SAN JOSE, Calif. &#151 The Defense Advanced Research Projects Agency (DARPA) has selected design software house PTC as the prime contractor for a research project to deliver three-dimensional (3D) ...

Over the years, the field of VLSI circuits has witnessed remarkable advancements. One such breakthrough is the advent of 3D integration, which has revolutionized the way integrated circuits are ...

SAN FRANCISCO, June 24, 2025 /PRNewswire/ -- Siemens Digital Industries Software today introduced two new solutions to its Electronic Design Automation (EDA) portfolio that help semiconductor design ...

The pedagogical model of the integrated circuit goes something like this: take a silicone wafer, etch out a few wells, dope some of the silicon with phosphorous, mask some of the chip off, dope some ...

Researchers began working on 3D integrated circuits almost two decades ago. In the first efforts, each stack, which contained a device layer and multiple interconnect layers, was fabricated separately ...

Siemens Digital Industries Software has extended its longstanding collaboration with TSMC through multiple new development projects, product certifications and innovative technology enablement for the ...

Leuven, Belgium – October 13, 2008 – IMEC, Europe’s leading independent nanoelectronics research institute today announced that it has made significant progress with its 3D-SIC (3D stacked IC) ...

The article explains the unique SI and PI challenges in 3D IC designs by contrasting them with traditional SoCs.

ANSYS Inc.’s ANSS flagship multiphysics analysis solutions are leveraged by Faraday Technology Corporation for the development of advanced designs for modern multi-die 2.5D/3D integrated circuits (ICs ...

The continuing trend of exponential growth in data communications and processing are driving the need for large-scale heterogeneous integration. Similar to the trend we have observed in electronic ...

is the thermal resistance between the object and the environment. The problem is to determine whether the integrated circuit in question is reliable at high temperatures. Without a particular method ...