Yield and cost have always been critical factors for both manufacturers and designers of semiconductor products. It is a continuous challenge to meet targets of both yield and cost, due to new device ...
A new technical paper titled “DeepOHeat-v1: Efficient Operator Learning for Fast and Trustworthy Thermal Simulation and Optimization in 3D-IC Design” was published by researchers at Intel Corporation, ...
The objective of the 3D-SCALO problem is to assign the given components to optimal mounting surfaces and position them at the best locations, while satisfying the requirements for (1) heat dissipation ...
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