Hybrid bonding—a significant advancement in chip packaging technology—is becoming vital in heterogeneous integration, which enables semiconductor companies to merge multiple chiplets with diverse ...

A new technical paper titled “Recent Progress in Structural Integrity Evaluation of Microelectronic Packaging Using Scanning Acoustic Microscopy (SAM): A Review” was published by researchers at ...

Most automated quality inspection technologies involve machine vision systems and, increasingly, aspects of artificial intelligence-powered software to speed the identification of part defects. But ...

For the best results with SAM systems, pay close attention to both the digitizer characteristics and the signal path. Automated inspection techniques are widely used in the semiconductor industry for ...

January 21, 2013. Imec and PVA Tepla have presented results regarding the detection of TSV voids in 3-D stacked IC technology. After having applied scanning acoustic microscopy (SAM) to temporary ...