A new technical paper titled “Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via ...

Driven by rapid advancement in mobile/server computing and automotive/communications, SoCs are experiencing a fast pace of functional integration along with technology scaling. Advanced low power ...

Thermal analysis comprises a group of techniques in which a physical property of a substance is measured as a function of temperature whilst the substance is subjected to a controlled temperature ...

There are some general requirements for the preparation of samples which are equally applicable to DSC, TGA, TMA and DMA. To evaluate the temperature gradient in the measured sample, a piece of indium ...