IEEE53m
Soumya Batra
Soumya Batra, co-author of Llama 3 and Llama 2, has 11 years of experience in Natural Language Processing. Her journey spans ...
IEEE1d
Steven H. Gold
Dr. Steven H. Gold received his Ph.D. in physics from the University of Maryland in 1978, and joined the Naval Research ...
IEEE4d
Advanced 3D Imaging Technologies for 3D IC Packages
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Non-Contact Measurement of Thermal Contact Resistance Using Lock-in Thermography
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Metrology for Hybrid Bonds, Microbumps and TSVs in Advanced Packaging – Are X-ray Methods Up to the Task?
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Metrology Solutions for Hybrid Bond Processes: How to Push the Limits?
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YAP: A Yield Model for Advanced Packaging
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Onshoring Advanced Packaging in the United States
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IEEE4d
Enabling Advanced Chiplet-Based Design
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IEEE4d
How Did the “Hybrid Bonding” Technology Become Reliable?
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Advances in W2W Hybrid and Fusion Bonding to Enable Device Inflections in Logic and Memory
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IEEE4d
Panel: Enabling Hybrid Bonding Proliferation
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